Experimental and numerical investigation of electrohydrodynamic flow in a point-to-ring corona discharge

Yifei Guan, Ravi Sankar Vaddi, Alberto Aliseda, and Igor Novosselov
Phys. Rev. Fluids 3, 043701 – Published 20 April 2018
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Abstract

An electrohydrodynamic (EHD) flow in a point-to-ring corona configuration is investigated experimentally and via a multiphysics computational model. The model couples the ion transport equation and the Navier-Stokes equations (NSE) to solve for the spatiotemporal distribution of electric field, flow field, and charge density. The numerical simulation results are validated against experimental measurements of the cathode voltage, ion concentration, and velocity profiles. The maximum flow velocity is at the centerline, and it decays rapidly with radial distance due to the viscous and electric forces acting on the partially ionized gas. To understand this coupling, a nondimensional parameter, X, is formulated as the ratio of the local electric force to the inertial term in the NSE. In the region of X1, the electric force dominates the flow dynamics, while in the X1 region, the balance of viscous and inertial terms yields traditional pipe flow characteristics. This approach expands on the analytical model of Guan et al. by adding a description of the developing flow region. The approach allows the model to be used for the entire EHD domain, providing insights into the near-field flow in the corona region.

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  • Received 16 October 2017
  • Corrected 27 June 2018

DOI:https://doi.org/10.1103/PhysRevFluids.3.043701

©2018 American Physical Society

Physics Subject Headings (PhySH)

  1. Research Areas
Fluid Dynamics

Corrections

27 June 2018

Correction: A minor typographical error in Eq. (3) has been corrected, and missing explanatory material in text afterward has been inserted.

Authors & Affiliations

Yifei Guan, Ravi Sankar Vaddi, Alberto Aliseda, and Igor Novosselov*

  • Department of Mechanical Engineering, University of Washington, Seattle, Washington 98195, USA

  • *ivn@uw.edu

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Issue

Vol. 3, Iss. 4 — April 2018

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