Thermal conductivity and its relation to atomic structure for symmetrical tilt grain boundaries in silicon

J. Hickman and Y. Mishin
Phys. Rev. Materials 4, 033405 – Published 30 March 2020
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Abstract

We perform a systematic study of thermal resistance and conductance of tilt grain boundaries (GBs) in Si using classical molecular dynamics. The GBs studied are naturally divided into three groups according to the structural units forming the GB core. We find that, within each group, the GB thermal conductivity strongly correlates with the excess GB energy. All three groups predict nearly the same GB conductivity extrapolated to the high-energy limit. This limiting value is close to the thermal conductivity of amorphous Si, suggesting similar heat transport mechanisms. While the lattice thermal conductivity decreases with temperature, the GB conductivity slightly increases. However, at high temperatures it turns over and starts decreasing if the GB structure undergoes a premelting transformation. Analysis of vibrational spectra of GBs resolved along different directions sheds light on the mechanisms of their thermal resistance. The existence of alternating tensile and compressive atomic environments in the GB core gives rise to localized vibrational modes, frequency gaps creating acoustic mismatch with lattice phonons, and anharmonic vibrations of loosely bound atoms residing in open atomic environments.

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  • Received 16 December 2019
  • Accepted 12 March 2020

DOI:https://doi.org/10.1103/PhysRevMaterials.4.033405

©2020 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

J. Hickman1 and Y. Mishin2

  • 1Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8910, USA
  • 2Department of Physics and Astronomy, MSN 3F3, George Mason University, Fairfax, Virginia 22030, USA

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Issue

Vol. 4, Iss. 3 — March 2020

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