Understanding the low resistivity of the amorphous phase of Cr2Ge2Te6 phase-change material: Experimental evidence for the key role of Cr clusters

Shogo Hatayama, Keisuke Kobayashi, Yuta Saito, Paul Fons, Yi Shuang, Shunsuke Mori, Alexander V. Kolobov, and Yuji Sutou
Phys. Rev. Materials 5, 085601 – Published 11 August 2021

Abstract

Different from the prototypical elemental semiconductors such as Si and Ge, chalcogenide-based phase-change materials (PCMs) generally show very high resistivity contrast between the amorphous and crystalline phases. In contrast to conventional PCMs, such as Ge-Sb-Te alloys, where the amorphous phase possesses higher resistivity, Cr2Ge2Te6 (CrGT) exhibits the opposite dependence. Namely, the amorphous phase is characterized by a lower resistivity than the crystalline phase. Although density functional theory calculations suggest that Cr clusters are responsible for the low resistivity of amorphous CrGT, the effects of composition on the electrical properties have yet to be investigated. In this work, the dependence of the electrical properties on Cr content and the role of the Cr clusters were investigated experimentally using Hall effect, hard x-ray photoelectron spectroscopy (HAXPES), and optical property measurements. The electrical properties were found to be dependent on the Cr content. From a HAXPES core-level spectra analysis, it was found that the increased carrier density correlated with the extent of Cr clusters, indicating that the hole carriers present likely originated from Cr clusters. The increased concentration of Cr clusters was also found to lead to a shift of the valence band edge toward the Fermi level as well as to a decrease in the optical band gap. It has been suggested that the Cr clusters may induce the formation of new energy states close to the valence band edge. These results indicate that the Cr clusters play an essential role in determining the electrical properties of amorphous CrGT, and that tuning the film composition is an effective way to optimize device properties for nonvolatile memory applications.

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  • Received 28 February 2021
  • Revised 13 July 2021
  • Accepted 21 July 2021

DOI:https://doi.org/10.1103/PhysRevMaterials.5.085601

©2021 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Shogo Hatayama1,2,*, Keisuke Kobayashi3,4, Yuta Saito2, Paul Fons2,5, Yi Shuang1, Shunsuke Mori1, Alexander V. Kolobov2,6, and Yuji Sutou1,†

  • 1Department of Materials Science, Graduate School of Engineering, Tohoku University, 6-6-11, Aoba-yama, Aoba-ku, Sendai 980-8579, Japan
  • 2Device Technology Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba Central 2, Umezono 1-1-1, Tsukuba 305-8568, Japan
  • 3Materials Sciences Research Center, Japan Atomic Energy Agency, 1-1-1 Kouto, Sayo-cho, Hyogo 679-5148, Japan
  • 4Research Institute of Kochi University of Technology, Tosa yamada, Kami City, Kochi 782-8502, Japan
  • 5Department of Electronics and Electrical Engineering, Faculty of Science and Technology, Keio University, 3-14-1, Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan
  • 6Department of Physical Electronics, Faculty of Physics, Herzen State Pedagogical University of Russia, 48 Moika Embankment, St. Petersburg 191186, Russia

  • *shogo-hatayama@aist.go.jp
  • ysutou@material.tohoku.ac.jp

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Issue

Vol. 5, Iss. 8 — August 2021

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