Link between volume, thermal expansion, and bulk metallic glass formability

A. K. Gangopadhyay, C. E. Pueblo, and K. F. Kelton
Phys. Rev. Materials 4, 095602 – Published 16 September 2020

Abstract

The specific volumes and thermal expansion coefficients of 41 transition-metal based alloy liquids, which include both bulk and marginal glass-formers, are presented. Those parameters are compared with their values either in the corresponding crystal phases or in their constituent elemental liquids. The volume differences in both cases at the liquidus temperature, Tl, correlate well with the critical thicknesses, dcrit of the corresponding glass, taken either from literature or from estimates. The estimates are based on a recent study [Dai et al., J. Non-Cryst. Solids 525, 119673 (2019)], which requires knowledge of the liquid expansion coefficient and viscosity. The volume differences between the better glass-forming liquids and the crystal phases are smaller; they are larger when compared with the elemental liquids. The thermal expansion coefficients of the liquids correlate well with the cohesive energies and fragilities. Their differences with the crystal phases and estimates from elemental liquids correlate well with dcrit. The differences are smaller for the former and larger for the latter for alloy liquids having larger values of dcrit. This parameter then appears to be a prime indicator of glass formability. The results are explained in terms of changes in the anharmonicity and structural contributions to the expansion coefficients on alloying.

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  • Received 20 May 2020
  • Revised 14 August 2020
  • Accepted 31 August 2020

DOI:https://doi.org/10.1103/PhysRevMaterials.4.095602

©2020 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied PhysicsPolymers & Soft Matter

Authors & Affiliations

A. K. Gangopadhyay*, C. E. Pueblo, and K. F. Kelton

  • Department of Physics, Washington University in St. Louis, St. Louis, Missouri 63130, USA

  • *anup@wuphys.wustl.edu

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Issue

Vol. 4, Iss. 9 — September 2020

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