Abstract
Kinetic roughening during thin film growth is a widely studied phenomenon, with many systems found to follow simple scaling laws. We show that for Cu electrodeposition from additive-free acid sulphate electrolyte, an extra scaling exponent is required to characterize the time evolution of the local roughness. The surface width scales as , when the deposition time is large or the size of the region over which is measured is small, and as when is large or is small. This is the first report of such anomalous scaling for an experimental ( )-dimensional system. When the deposition current density or Cu concentration is varied, only changes, while the other power law exponents and remain constant.
- Received 21 June 2000
DOI:https://doi.org/10.1103/PhysRevLett.86.256
©2001 American Physical Society