Laser-induced thermal desorption as an in situ surface probe during plasma processing

I. P. Herman, V. M. Donnelly, K. V. Guinn, and C. C. Cheng
Phys. Rev. Lett. 72, 2801 – Published 25 April 1994
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Abstract

We report a new technique for detecting adsorbates in real time during plasma processing. During etching of Si(100) in a Cl2 plasma, pulsed XeCl excimer laser irradiation of the surface induces thermal desorption of SiClx (x=0–4). Desorbing products are detected by either laser-induced fluorescence (for SiCl) excited by the same laser pulse, or by plasma-induced emission (for SiCl and Si) from electron impact excitation. The technique has a time resolution of <0.1s and submonolayer sensitivity, and should be applicable to processes at high ambient pressure.

  • Received 10 January 1994

DOI:https://doi.org/10.1103/PhysRevLett.72.2801

©1994 American Physical Society

Authors & Affiliations

I. P. Herman, V. M. Donnelly, K. V. Guinn, and C. C. Cheng

  • AT&T Bell Laboratories, Murray Hill, New Jersey 07974

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Vol. 72, Iss. 17 — 25 April 1994

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