• Open Access

Heavy Quark Diffusion from 2+1 Flavor Lattice QCD with 320 MeV Pion Mass

Luis Altenkort, Olaf Kaczmarek, Rasmus Larsen, Swagato Mukherjee, Peter Petreczky, Hai-Tao Shu, and Simon Stendebach (HotQCD Collaboration)
Phys. Rev. Lett. 130, 231902 – Published 6 June 2023
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Abstract

We present the first calculations of the heavy flavor diffusion coefficient using lattice QCD with light dynamical quarks corresponding to a pion mass of around 320 MeV. For temperatures 195MeV<T<352MeV, the heavy quark spatial diffusion coefficient is found to be significantly smaller than previous quenched lattice QCD and recent phenomenological estimates. The result implies very fast hydrodynamization of heavy quarks in the quark-gluon plasma created during ultrarelativistic heavy-ion collision experiments.

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  • Received 22 February 2023
  • Revised 17 April 2023
  • Accepted 24 April 2023

DOI:https://doi.org/10.1103/PhysRevLett.130.231902

Published by the American Physical Society under the terms of the Creative Commons Attribution 4.0 International license. Further distribution of this work must maintain attribution to the author(s) and the published article’s title, journal citation, and DOI. Funded by SCOAP3.

Published by the American Physical Society

Physics Subject Headings (PhySH)

  1. Research Areas
  1. Techniques
Particles & Fields

Authors & Affiliations

Luis Altenkort1,*, Olaf Kaczmarek1, Rasmus Larsen2, Swagato Mukherjee3, Peter Petreczky3, Hai-Tao Shu4,†, and Simon Stendebach5 (HotQCD Collaboration)

  • 1Fakultät für Physik, Universität Bielefeld, D-33615 Bielefeld, Germany
  • 2Department of Mathematics and Physics, University of Stavanger, Stavanger, Norway
  • 3Physics Department, Brookhaven National Laboratory, Upton, New York 11973, USA
  • 4Institut für Theoretische Physik, Universität Regensburg, D-93040 Regensburg, Germany
  • 5Insitut für Kernphysik, Technische Universität Darmstadt, Schlossgartenstraße 2, D-64289 Darmstadt, Germany

  • *altenkort@physik.uni-bielefeld.de
  • hai-tao.shu@ur.de

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Issue

Vol. 130, Iss. 23 — 9 June 2023

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