High-Dimensional Entanglement-Enabled Holography

Ling-Jun Kong, Yifan Sun, Furong Zhang, Jingfeng Zhang, and Xiangdong Zhang
Phys. Rev. Lett. 130, 053602 – Published 2 February 2023
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Abstract

As an important imaging technique, holography has been realized with different physical dimensions of light, including polarization, wavelength, and time. Recently, quantum holography has been demonstrated by utilizing polarization entangled state with the advantages of high robustness and enhanced spatial resolution, comparing with classical holography. However, the polarization is only a two-dimensional degree of freedom, which greatly limits the capacity of quantum holography. Here, we propose a method to realize high-dimensional quantum holography by using high-dimensional orbital angular momentum (OAM) entanglement. A high-capacity OAM-encoded quantum holographic system can be obtained by multiplexing a wide range of OAM-dependent holographic images. Proof-of-principle experiments with four- and six-dimensional OAM entangled states have been implemented and verify the feasibility of our idea. Our experimental results also demonstrate that the high-dimensional quantum holography shows a high robustness to classical noise. What is more, the level of security of the holographic imaging encryption system can be greatly improved in our high-dimensional quantum holography.

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  • Received 28 August 2022
  • Accepted 9 January 2023

DOI:https://doi.org/10.1103/PhysRevLett.130.053602

© 2023 American Physical Society

Physics Subject Headings (PhySH)

Quantum Information, Science & Technology

Authors & Affiliations

Ling-Jun Kong*, Yifan Sun*, Furong Zhang, Jingfeng Zhang, and Xiangdong Zhang

  • Key Laboratory of Advanced Optoelectronic Quantum Architecture and Measurements of Ministry of Education, Beijing Key Laboratory of Nanophotonics and Ultrafine Optoelectronic Systems, School of Physics, Beijing Institute of Technology, 100081 Beijing, China

  • *These authors contributed equally to this work.
  • Corresponding author. zhangxd@bit.edu.cn

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Issue

Vol. 130, Iss. 5 — 3 February 2023

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