Enhanced Thermal Hall Effect in Nearly Ferroelectric Insulators

Jing-Yuan Chen, Steven A. Kivelson, and Xiao-Qi Sun
Phys. Rev. Lett. 124, 167601 – Published 21 April 2020
PDFHTMLExport Citation

Abstract

In the context of recent experimental observations of an unexpectedly large thermal Hall conductivity, κH, in insulating La2CuO4 (LCO) and SrTiO3 (STO), we theoretically explore conditions under which acoustic phonons can give rise to such a large κH. Both the intrinsic and extrinsic contributions to κH are large in proportion to the dielectric constant, ε, and the “flexoelectric” coupling, F. While the intrinsic contribution is still orders of magnitude smaller than the observed effect, an extrinsic contribution proportional to the phonon mean-free path appears likely to account for the observations, at least in STO. We predict a larger intrinsic κH in certain insulating perovskites.

  • Received 13 November 2019
  • Accepted 7 April 2020

DOI:https://doi.org/10.1103/PhysRevLett.124.167601

© 2020 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Jing-Yuan Chen1, Steven A. Kivelson2, and Xiao-Qi Sun2,3

  • 1Stanford Institute for Theoretical Physics, Stanford University, Stanford, California 94305, USA
  • 2Department of Physics, Stanford University, Stanford, California 94305, USA
  • 3Stanford Center for Topological Quantum Physics, Stanford University, Stanford, California 94305, USA

Article Text (Subscription Required)

Click to Expand

Supplemental Material (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 124, Iss. 16 — 24 April 2020

Reuse & Permissions
Access Options
CHORUS

Article Available via CHORUS

Download Accepted Manuscript
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review Letters

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×