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Universal Scaling Laws in Schottky Heterostructures Based on Two-Dimensional Materials

Yee Sin Ang, Hui Ying Yang, and L. K. Ang
Phys. Rev. Lett. 121, 056802 – Published 1 August 2018
Physics logo See Synopsis: Universal Scaling Laws for 2D Schottky Diodes
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Abstract

We identify a new universality in the carrier transport of two-dimensional (2D) material-based Schottky heterostructures. We show that the reversed saturation current (J) scales universally with temperature (T) as log(J/Tβ)1/T, with β=3/2 for lateral Schottky heterostructures and β=1 for vertical Schottky heterostructures, over a wide range of 2D systems including nonrelativistic electron gas, Rashba spintronic systems, single- and few-layer graphene, transition metal dichalcogenides, and thin films of topological solids. Such universalities originate from the strong coupling between the thermionic process and the in-plane carrier dynamics. Our model resolves some of the conflicting results from prior works and is in agreement with recent experiments. The universal scaling laws signal the breakdown of β=2 scaling in the classic diode equation widely used over the past sixty years. Our findings shall provide a simple analytical scaling for the extraction of the Schottky barrier height in 2D material-based heterostructures, thus paving the way for both a fundamental understanding of nanoscale interface physics and applied device engineering.

  • Figure
  • Received 19 February 2018
  • Revised 10 May 2018

DOI:https://doi.org/10.1103/PhysRevLett.121.056802

© 2018 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Synopsis

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Universal Scaling Laws for 2D Schottky Diodes

Published 1 August 2018

Long-sought simple scaling laws could pave the way for optimization of a vast array of 2D electronics.

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Authors & Affiliations

Yee Sin Ang*, Hui Ying Yang, and L. K. Ang

  • SUTD-MIT International Design Center & Science and Math Cluster, Singapore University of Technology and Design (SUTD), 8 Somapah Road, Singapore 487372

  • *yeesin_ang@sutd.edu.sg
  • ricky_ang@sutd.edu.sg

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Issue

Vol. 121, Iss. 5 — 3 August 2018

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