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Phonon Networks with Silicon-Vacancy Centers in Diamond Waveguides

M.-A. Lemonde, S. Meesala, A. Sipahigil, M. J. A. Schuetz, M. D. Lukin, M. Loncar, and P. Rabl
Phys. Rev. Lett. 120, 213603 – Published 25 May 2018
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Abstract

We propose and analyze a novel realization of a solid-state quantum network, where separated silicon-vacancy centers are coupled via the phonon modes of a quasi-one-dimensional diamond waveguide. In our approach, quantum states encoded in long-lived electronic spin states can be converted into propagating phonon wave packets and be reabsorbed efficiently by a distant defect center. Our analysis shows that under realistic conditions, this approach enables the implementation of high-fidelity, scalable quantum communication protocols within chip-scale spin-qubit networks. Apart from quantum information processing, this setup constitutes a novel waveguide QED platform, where strong-coupling effects between solid-state defects and individual propagating phonons can be explored at the quantum level.

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  • Received 8 January 2018

DOI:https://doi.org/10.1103/PhysRevLett.120.213603

© 2018 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied PhysicsQuantum Information, Science & TechnologyAtomic, Molecular & Optical

Authors & Affiliations

M.-A. Lemonde1,5, S. Meesala2, A. Sipahigil3,4, M. J. A. Schuetz4, M. D. Lukin4, M. Loncar2, and P. Rabl1

  • 1Vienna Center for Quantum Science and Technology, Atominstitut, TU Wien, 1040 Vienna, Austria
  • 2John A. Paulson School of Engineering and Applied Sciences, Harvard University, 29 Oxford Street, Cambridge, Massachusetts 02138, USA
  • 3Institute for Quantum Information and Matter and Thomas J. Watson, Sr., Laboratory of Applied Physics, California Institute of Technology, Pasadena, California 91125, USA
  • 4Department of Physics, Harvard University, Cambridge, Massachusetts 02138, USA
  • 5Centre for Quantum Technologies, National University of Singapore, 3 Science Drive 2, Singapore 117543, Singapore

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Issue

Vol. 120, Iss. 21 — 25 May 2018

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