Significant Enhancement of Near-Field Electromagnetic Heat Transfer in a Multilayer Structure through Multiple Surface-States Coupling

Hideo Iizuka and Shanhui Fan
Phys. Rev. Lett. 120, 063901 – Published 8 February 2018
PDFHTMLExport Citation

Abstract

We show that near-field electromagnetic heat transfer between multilayer thermal bodies can be significantly enhanced by the contributions of surface states at multiple surfaces. As a demonstration, we show that when one of the materials forming the multilayer structure is described by the Drude model, and the other one is a vacuum, at the same gap spacing the resulting heat transfer can be up to 40 times higher as compared to that between two semi-infinite materials described by the same Drude model. Moreover, this system can exhibit a nonmonotonic dependency in its heat transfer coefficient as a function of the middle gap spacing. The enhancement effect in the system persists for realistic materials.

  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Received 4 October 2017

DOI:https://doi.org/10.1103/PhysRevLett.120.063901

© 2018 American Physical Society

Physics Subject Headings (PhySH)

Nonlinear DynamicsAtomic, Molecular & Optical

Authors & Affiliations

Hideo Iizuka1,* and Shanhui Fan2,†

  • 1Toyota Research Institute of North America, Toyota Motor North America, Ann Arbor, Michigan 48105, USA
  • 2Department of Electrical Engineering, Ginzton Laboratory, Stanford University, Stanford, California 94305, USA

  • *hideo.iizuka@toyota.com
  • shanhui@stanford.edu

Article Text (Subscription Required)

Click to Expand

Supplemental Material (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 120, Iss. 6 — 9 February 2018

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review Letters

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×