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Densification and Strain Hardening of a Metallic Glass under Tension at Room Temperature

Z. T. Wang, J. Pan, Y. Li, and C. A. Schuh
Phys. Rev. Lett. 111, 135504 – Published 26 September 2013
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Abstract

The deformation of metallic glasses involves two competing processes: a disordering process involving dilatation, free volume accumulation, and softening, and a relaxation process involving diffusional ordering and densification. For metallic glasses at room temperature and under uniaxial loading, disordering usually dominates, and the glass can fail catastrophically as the softening process runs away in a localized mode. Here we demonstrate conditions where the opposite, unexpected, situation occurs: the densifying process dominates, resulting in stable plastic deformation and work hardening at room temperature. We report densification and hardening during deformation in a Zr-based glass under multiaxial loading, in a notched tensile geometry. The effect is driven by stress-enhanced diffusional relaxation, and is attended by a reduction in exothermic heat and hardening signatures similar to those observed in the classical thermal relaxation of glasses. The result is significant, stable, plastic, extensional flow in metallic glasses, which suggest a possibility of designing tough glasses based on their flow properties.

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  • Received 9 July 2013

DOI:https://doi.org/10.1103/PhysRevLett.111.135504

© 2013 American Physical Society

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Published 26 September 2013

Strain hardening hasn’t traditionally worked for metallic glasses, but researchers have found certain conditions in which it might.

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Authors & Affiliations

Z. T. Wang1, J. Pan1, Y. Li1,2,*, and C. A. Schuh3,†

  • 1Department of Materials Science and Engineering, National University of Singapore, Singapore 117576
  • 2Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
  • 3Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

  • *Corresponding author. mseliy@nus.edu.sg
  • Corresponding author. schuh@MIT.EDU

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Issue

Vol. 111, Iss. 13 — 27 September 2013

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