Synergy between the crack pattern and substrate elasticity in colloidal deposits

Hisay Lama, Tonmoy Gogoi, Madivala G. Basavaraj, Ludovic Pauchard, and Dillip K. Satapathy
Phys. Rev. E 103, 032602 – Published 3 March 2021
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Abstract

Desiccation cracks in colloidal deposits occur to release the excess strain energy arising from the competition between the drying induced shrinkage of the deposit and its adhesion to the substrate. Here we report remarkably different morphology of desiccation cracks in the dried patterns formed by the evaporation of sessile drops containing colloids on elastomer (soft) or glass (stiff) substrates. The change in the crack pattern, i.e., from radial cracks on stiff substrates to circular cracks on soft substrates, is shown to arise solely due to the variation in elasticity of the underlying substrates. Our experiments and calculations reveal an intricate correlation between the desiccation crack patterns and the substrate's elasticity. The mismatch in modulus of elasticity between the substrate and that of the particulate deposit significantly alters the energy release rate during the nucleation and propagation of cracks. The stark variation in crack morphology is attributed to the tensile or compressive nature of the drying-induced in-plane stresses.

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  • Received 30 July 2020
  • Accepted 5 February 2021

DOI:https://doi.org/10.1103/PhysRevE.103.032602

©2021 American Physical Society

Physics Subject Headings (PhySH)

  1. Research Areas
  1. Physical Systems
Polymers & Soft Matter

Authors & Affiliations

Hisay Lama1,2,3, Tonmoy Gogoi1, Madivala G. Basavaraj2, Ludovic Pauchard4, and Dillip K. Satapathy1,*

  • 1Soft Materials Laboratory, Department of Physics, IIT Madras, Chennai-600036, India
  • 2Department of Chemical Engineering, IIT Madras, Chennai-600036, India
  • 3IBS Center for Soft and Living Matter, UNIST, Ulsan-44919, South Korea
  • 4Laboratoire FAST, Université Paris-Sud, CNRS, Université Paris-Saclay, F-91405, Orsay, France

  • *dks@iitm.ac.in

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Issue

Vol. 103, Iss. 3 — March 2021

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