Twist-projected two-dimensional acoustic topological insulators

Ming-Jun Tuo, Li-Heng Zhang, Dong Liu, Ru-Wen Peng, Ren-Hao Fan, Ze-Guo Chen, Ying Wu, Dong-Xiang Qi, and Mu Wang
Phys. Rev. B 99, 205432 – Published 24 May 2019

Abstract

Acoustic analogs of electronic or photonic topological insulators provide unique approaches to manipulate sound wave propagation. Inspired by twist-induced topological photonic insulators, here we propose a type of two-dimensional acoustic topological insulator (TI) via projecting a section of a three-dimensional twisting structure to a plane, assembling the projected meta-atoms into metamolecules, and arranging the metamolecules into unit cells to form a honeycomb lattice. It follows that in this acoustic TI, topological phases mimic pseudospin-up and pseudospin-down states, and the pseudospin-orbital couplings are tuned via changing the rotation angles of the meta-atoms, which eventually leads to band inversion. By calculating acoustic band structures, pressure field distributions, and spin Chern numbers of bands, we verify that the topological phase transition occurs around the double Dirac cone and present the topological phase diagram as a function of the rotation angle of the meta-atoms. Once the coupling between adjacent metamolecules is sufficiently strong, mode inversion of topological states emerges. Furthermore, we numerically demonstrate the existence of topologically protected edge states. It is shown that robust pseudospin-dependent one-way transmission is immune to defects at the edge of topological distinct regions, which can be applied to acoustic wave transmissions and communications. Our approach in acoustic systems provides a strategy to explore abundant topological states in two-dimensional systems.

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  • Received 10 January 2019

DOI:https://doi.org/10.1103/PhysRevB.99.205432

©2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Ming-Jun Tuo1, Li-Heng Zhang1, Dong Liu1, Ru-Wen Peng1,*, Ren-Hao Fan1, Ze-Guo Chen2, Ying Wu2, Dong-Xiang Qi1, and Mu Wang1,†

  • 1National Laboratory of Solid State Microstructures, School of Physics, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China
  • 2Division of Computer, Electrical and Mathematical Sciences and Engineering, King Abdullah University of Science and Technology, Thuwal 23955-6900, Saudi Arabia

  • *Corresponding author: rwpeng@nju.edu.cn
  • Corresponding author: muwang@nju.edu.cn

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Issue

Vol. 99, Iss. 20 — 15 May 2019

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