Vertical temperature boundary of the pseudogap under the superconducting dome in the phase diagram of Bi2Sr2CaCu2O8+δ

B. Loret, S. Sakai, S. Benhabib, Y. Gallais, M. Cazayous, M. A. Méasson, R. D. Zhong, J. Schneeloch, G. D. Gu, A. Forget, D. Colson, I. Paul, M. Civelli, and A. Sacuto
Phys. Rev. B 96, 094525 – Published 25 September 2017

Abstract

Combining electronic Raman scattering experiments with cellular dynamical mean field theory, we present evidence of the pseudogap in the superconducting state of various hole-doped cuprates. In Bi2Sr2CaCu2O8+δ we track the superconducting pseudogap hallmark, a peak-dip feature, as a function of temperature T and doping p, well beyond the optimal one. We show that, at all temperatures under the superconducting dome, the pseudogap disappears at the doping pc, between 0.222 and 0.226, where also the normal-state pseudogap collapses at a Lifshitz transition. This demonstrates that the superconducting pseudogap boundary forms a vertical line in the Tp phase diagram.

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  • Received 24 February 2017
  • Revised 9 September 2017

DOI:https://doi.org/10.1103/PhysRevB.96.094525

©2017 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

B. Loret1,2, S. Sakai3, S. Benhabib1, Y. Gallais1, M. Cazayous1, M. A. Méasson1, R. D. Zhong4, J. Schneeloch4, G. D. Gu4, A. Forget2, D. Colson2, I. Paul1, M. Civelli5, and A. Sacuto1

  • 1Laboratoire Matériaux et Phénomènes Quantiques (UMR 7162 CNRS), Université Paris Diderot-Paris 7, Bat. Condorcet, 75205 Paris Cedex 13, France
  • 2Service de Physique de l'État Condensé, DSM/IRAMIS/SPEC (UMR 3680 CNRS), CEA Saclay 91191 Gif sur Yvette cedex France
  • 3Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
  • 4Matter Physics and Materials Science, Brookhaven National Laboratory (BNL), Upton, New York 11973, USA
  • 5Laboratoire de Physique des Solides, CNRS, Univ. Paris-Sud, Université Paris-Saclay, 91405 Orsay Cedex, France

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Issue

Vol. 96, Iss. 9 — 1 September 2017

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