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Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces

Chengyun Hua, Xiangwen Chen, Navaneetha K. Ravichandran, and Austin J. Minnich
Phys. Rev. B 95, 205423 – Published 17 May 2017

Abstract

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. However, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electron microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. Our work provides a useful perspective on the microscopic processes governing interfacial heat conduction.

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  • Received 23 December 2016
  • Revised 17 March 2017

DOI:https://doi.org/10.1103/PhysRevB.95.205423

©2017 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Chengyun Hua1, Xiangwen Chen2, Navaneetha K. Ravichandran3, and Austin J. Minnich2,*

  • 1Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831, USA
  • 2California Institute of Technology, Pasadena, California 91125, USA
  • 3Boston College, Chestnut Hill, Massachusetts 02467, USA

  • *Corresponding author: aminnich@caltech.edu

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Issue

Vol. 95, Iss. 20 — 15 May 2017

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