Low-temperature relaxor state induced by epitaxial compression in PbSc0.5Nb0.5O3 films

M. Tyunina, J. Levoska, P.-E. Janolin, and A. Dejneka
Phys. Rev. B 87, 224107 – Published 14 June 2013

Abstract

The use of high-performance perovskite-structure epitaxial relaxor ferroelectric films [S. H. Baek et al., Science 334, 958 (2011)] is hindered by the lack of knowledge of epitaxial effects therein. It is experimentally shown here that a biaxial epitaxial compression can favor the relaxor state over ferroelectricity. The absence of the ferroelectric transition and the existence of the low-temperature relaxor state are evidenced by a combination of x-ray diffraction, dielectric, polarization, and optical studies of PbSc0.5Nb0.5O3 films epitaxially grown on La0.5Sr0.5CoO3/MgO(001). This finding is beyond existing models of polarization in perovskite-structure epitaxial films and beyond the established ability to induce ferroelectricity by an epitaxial strain.

  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
3 More
  • Received 4 April 2013

DOI:https://doi.org/10.1103/PhysRevB.87.224107

©2013 American Physical Society

Authors & Affiliations

M. Tyunina1,2, J. Levoska1, P.-E. Janolin3, and A. Dejneka2

  • 1Microelectronics and Materials Physics Laboratories, University of Oulu, P. O. Box 4500, FI-90014 Oulun yliopisto, Finland
  • 2Institute of Physics, Academy of Sciences of the Czech Republic, Na Slovance 2, 182 21 Prague 8, Czech Republic
  • 3Laboratoire Structures, Propriétés et Modélisation des Solides, Ecole Centrale Paris, 92290 Châtenay-Malabry, France

Article Text (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 87, Iss. 22 — 1 June 2013

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review B

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×