Abstract
The origin of the “cracks” between the platelets in melt-processed superconductors is investigated experimentally. The results convincingly demonstrate that these cracks actually develop during solidification. The relevance of this to the microstructural evolution during melt processing and to the critical-current densities is discussed.
- Received 11 August 1997
DOI:https://doi.org/10.1103/PhysRevB.57.5079
©1998 American Physical Society