Oxygen diffusion in epitaxial YBa2Cu3O7x thin films

S. H. Lee, S. C. Bae, J. K. Ku, and H. J. Shin
Phys. Rev. B 46, 9142 – Published 1 October 1992
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Abstract

In situ resistance changes of YBa2Cu3O7x thin films during deposition were investigated at four different substrate temperatures in the 560–700 °C range. The shapes of the resistance curves with time and the measurement of deposition rates clearly indicated that the film grew epitaxially on the (100)SrTiO3 substrate at 700 °C. Isothermal oxygen diffusion along the c-axis direction into the epitaxially grown YBa2Cu3O7x thin films was investigated by monitoring in situ resistance changes in the 450–600 °C range; the apparent diffusion coefficients were (3.1–6.3)×1011 cm2/s. An Arrhenius plot of the diffusion coefficients in the 450–550 °C range gave an activation energy of 0.33 eV for oxygen diffusion plus a tetragonal-orthorhombic phase transition.

  • Received 23 March 1992

DOI:https://doi.org/10.1103/PhysRevB.46.9142

©1992 American Physical Society

Authors & Affiliations

S. H. Lee, S. C. Bae, and J. K. Ku

  • Department of Chemistry, Pohang Institute of Science and Technology, Pohang, P.O. Box 125, Kyungbuk 790-600, Korea

H. J. Shin

  • Basic Science Division, Research Institute of Industrial Science Technology, Pohang, P.O. Box 135, Kyungbuk 790-600, Korea

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Vol. 46, Iss. 14 — 1 October 1992

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