Coexistence of ferromagnetism and topology by charge carrier engineering in the intrinsic magnetic topological insulator MnBi4Te7

Bo Chen, Dinghui Wang, Zhicheng Jiang, Bo Zhang, Shengtao Cui, Jingwen Guo, Hangkai Xie, Yong Zhang, Muhammad Naveed, Yu Du, Xuefeng Wang, Haijun Zhang, Fucong Fei, Dawei Shen, Zhe Sun, and Fengqi Song
Phys. Rev. B 104, 075134 – Published 18 August 2021
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Abstract

Intrinsic magnetic topological insulators (MTIs) MnBi2Te4 and MnBi2Te4/(Bi2Te3)n are expected to realize the high-temperature quantum anomalous Hall effect and dissipationless electrical transport. However, there is still a lack of ideal MTI candidates with magnetic ordering of the ferromagnetic (FM) ground state. Here, we show a MTI sample of Mn(Bi0.7Sb0.3)4Te7 which holds the coexistence of a FM behavior state and topological nontriviality. The dramatic modulation of the magnetism is induced by a charge carrier engineering process via the Sb substitution in the MnBi4Te7 matrix with antiferromagnetic ordering. The evolution of magnetism in Mn(Bi1xSbx)4Te7 is systematically investigated by our magnetic measurements and theoretical calculations. The clear topological surface states of the FM sample of Mn(Bi0.7Sb0.3)4Te7 are further verified by angle-resolved photoemission spectroscopy. The demonstration of the intrinsic FM-MTI of Mn(Bi0.7Sb0.3)4Te7 in this paper sheds light on further material optimization of intrinsic MTIs and paves the way for further studies to clarify the relationships between topology, magnetism, and charge carriers in topological materials.

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  • Received 6 February 2021
  • Accepted 29 July 2021

DOI:https://doi.org/10.1103/PhysRevB.104.075134

©2021 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Bo Chen1,2, Dinghui Wang1, Zhicheng Jiang3, Bo Zhang4, Shengtao Cui4, Jingwen Guo1,2, Hangkai Xie1,2, Yong Zhang1,2, Muhammad Naveed1,2, Yu Du1,2, Xuefeng Wang2,5, Haijun Zhang1, Fucong Fei1,2,*, Dawei Shen3,†, Zhe Sun4,‡, and Fengqi Song1,2

  • 1National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and College of Physics, Nanjing University, Nanjing 210093, China
  • 2Atomic Manufacture Institute (AMI), Nanjing 211805, China
  • 3Center for Excellence in Superconducting Electronics, State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
  • 4National Synchrotron Radiation Laboratory, University of Science and Technology of China, 230029 Hefei, China
  • 5School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China

  • *feifucong@nju.edu.cn
  • dwshen@mail.sim.ac.cn
  • zsun@ustc.edu.cn

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Issue

Vol. 104, Iss. 7 — 15 August 2021

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