Robust hybridization gap in the Kondo insulator YbB12 probed by femtosecond optical spectroscopy

A. R. Pokharel, S. Y. Agustsson, V. V. Kabanov, F. Iga, T. Takabatake, H. Okamura, and J. Demsar
Phys. Rev. B 103, 115134 – Published 18 March 2021

Abstract

In heavy fermions the relaxation dynamics of photoexcited carriers has been found to be governed by the low energy indirect gap Eg resulting from hybridization between localized moments and conduction band electrons. Here, carrier relaxation dynamics in a prototype Kondo insulator YbB12 is studied over a large range of temperatures and over three orders of magnitude. We utilize the intrinsic nonlinearity of dynamics to quantitatively determine microscopic parameters, such as electron-hole recombination rate. The extracted value reveals that hybridization is accompanied by a strong charge transfer from localized 4f levels. The results imply the presence of a hybridization gap up to temperatures of the order of Eg/kB200 K, which is extremely robust against electronic excitation. Finally, below 20 K the data reveal changes in the low energy electronic structure, attributed to short-range antiferromagnetic correlations between the localized levels.

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  • Received 24 November 2020
  • Revised 4 March 2021
  • Accepted 5 March 2021

DOI:https://doi.org/10.1103/PhysRevB.103.115134

©2021 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

A. R. Pokharel1, S. Y. Agustsson1, V. V. Kabanov2, F. Iga3, T. Takabatake4, H. Okamura5, and J. Demsar1

  • 1Institute of Physics, Johannes Gutenberg-University Mainz, 51099 Mainz, Germany
  • 2Dept. of Complex Matter, Jozef Stefan Institute, 1000 Ljubljana, Slovenia
  • 3Institute for Quantum Beam Sciences, Ibaraki University, Mito 310-8512, Japan
  • 4Graduate School of Advanced Science and Engineering, Hiroshima University, Higashi-Hiroshima 739-8530, Japan
  • 5Graduate School of Technology, Industrial and Social Sciences, Tokushima University, Tokushima 770-8506, Japan

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Issue

Vol. 103, Iss. 11 — 15 March 2021

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