Boosting the thermoelectric performance of Fe2VAltype Heusler compounds by band engineering

F. Garmroudi, A. Riss, M. Parzer, N. Reumann, H. Müller, E. Bauer, S. Khmelevskyi, R. Podloucky, T. Mori, K. Tobita, Y. Katsura, and K. Kimura
Phys. Rev. B 103, 085202 – Published 1 February 2021
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Abstract

Linking the fundamental physics of band structure and scattering theory with macroscopic features such as measured temperature dependencies of electronic and thermal transport is indispensable to a thorough understanding of thermoelectric phenomena and ensures more targeted and efficient experimental research. Regarding Fe2VAl-based compounds, experimental work has seen mostly qualitative and often speculative interpretations, preventing this class of materials from tapping their full potential when it comes to applications. In this paper, the temperature-dependent Seebeck coefficient and electrical resistivity of a set of p-type and n-type samples with the composition Fe2V1xTaxAl1ySiy are presented from 4 K up to 800 K as well as the Hall mobility and carrier concentration from 4 K to 520 K. We attempt a quantitative analysis of our data using a parabolic two- and three-band model and compare the model results with those from density functional theory calculations. Our findings show an increase of the band gap Eg from almost zero in undoped Fe2VAl toward Eg0.1eV with increasing Ta substitution, consistent with results from first-principles calculations. Due to the resulting enhancement of the Seebeck coefficient, the maximum power factor is boosted up to 10.3 mW/mK2, which is, to the best of our knowledge, the highest value among n-type bulk semiconductor systems reported near room temperature up until now. We further show that for the p-type Fe2V1xTaxAl compounds, the dominant scattering mechanism of electrons is intrinsically different compared to the n-type samples, for which acoustic phonon scattering can well describe the temperature-dependent Hall mobility in a broad range of temperatures.

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  • Received 20 November 2020
  • Revised 8 January 2021
  • Accepted 11 January 2021

DOI:https://doi.org/10.1103/PhysRevB.103.085202

©2021 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

F. Garmroudi*, A. Riss, M. Parzer, N. Reumann, H. Müller, and E. Bauer

  • Institute of Solid State Physics, Technische Universität Wien, A-1040 Vienna, Austria

S. Khmelevskyi

  • Research Center for the Computational Materials Science and Engineering, Technische Universität Wien, A-1040 Vienna, Austria

R. Podloucky

  • Institute of Physical Chemistry, Universität Wien, A-1090 Vienna, Austria

T. Mori

  • International Center for Materials Nanoarchitectonics (WPI-MANA), National Institute for Materials Science, Tsukuba 305-0044, Japan

K. Tobita, Y. Katsura, and K. Kimura

  • Department of Advanced Materials Science, The University of Tokyo, Kashiwa, Chiba 277-8561, Japan

  • *Corresponding author: fabian.garmroudi@tuwien.ac.at

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Issue

Vol. 103, Iss. 8 — 15 February 2021

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