Metal-insulator transition in organic ion intercalated VSe2 induced by dimensional crossover

F. B. Meng, Z. Liu, L. X. Yang, M. Z. Shi, B. H. Ge, H. Zhang, J. J. Ying, Z. F. Wang, Z. Y. Wang, T. Wu, and X. H. Chen
Phys. Rev. B 102, 165410 – Published 19 October 2020

Abstract

The charge-density wave (CDW) transition has been extensively studied in transition metal dichalcogenides (TMDs), the underlying mechanism and the related metal-insulator transition are not as simple as Peierls instability in one dimension and still under hot debate. Here, through electrochemical intercalation of organic ions, we have observed a dimensional crossover induced metal-insulator transition in an organic ion intercalated TMDs: (TBA)0.3VSe2. In pristine VSe2, previous studies have revealed a three-dimensional CDW transition at TCDW110K with a metallic ground state. After intercalation of organic ions, the remarkable anisotropy of resistivity indicates a highly two-dimensional electronic state in (TBA)0.3VSe2, which is consistent with our density functional theory (DFT) calculation. Interestingly, the dimensional crossover enhances the CDW transition with TCDW of 165 K and leads to an insulating ground state in (TBA)0.3VSe2. Moreover, a commensurate superstructure with 3a×3a periodicity is also confirmed in this insulating CDW state. Although the DFT calculation suggests that the commensurate superstructure and the enhanced CDW temperature could be ascribed to the improved Fermi surface nesting, whether the metal-insulator transition is driven by a perfect Fermi surface nesting is still elusive at the present stage. The possible role of electronic correlation and electron-phonon coupling has also been discussed. Our work provides a different material platform to study the metal-insulator transition in TMDs.

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  • Received 10 May 2020
  • Revised 29 September 2020
  • Accepted 29 September 2020

DOI:https://doi.org/10.1103/PhysRevB.102.165410

©2020 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

F. B. Meng1, Z. Liu1, L. X. Yang2, M. Z. Shi1, B. H. Ge3,4, H. Zhang3, J. J. Ying1, Z. F. Wang1, Z. Y. Wang1, T. Wu1,5,7, and X. H. Chen1,5,6,7,*

  • 1Hefei National Laboratory for Physical Sciences at Microscale and Department of Physics, and CAS Key Laboratory of Strongly-coupled Quantum Matter Physics, University of Science and Technology of China, Hefei, Anhui 230026, China
  • 2Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China
  • 3Institutes of Physical Science and Information Technology, Anhui University, Hefei 230601, China
  • 4Key Laboratory of Structure and Functional Regulation of Hybrid Materials (Anhui University), Ministry of Education, Hefei 230601, China
  • 5CAS Center for Excellence in Superconducting Electronics (CENSE), Shanghai 200050, China
  • 6CAS Center for Excellence in Quantum Information and Quantum Physics, Hefei, Anhui 230026, China
  • 7Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China

  • *chenxh@ustc.edu.cn

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Vol. 102, Iss. 16 — 15 October 2020

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