Enhanced Low-Temperature Thermoelectric Performance in the Two-Dimensional AMnX Family

Xincan Wang, De Zhang, Xu Lu, Guang Han, Xiaolong Yang, Guoyu Wang, Zizhen Zhou, Huixia Fu, and Xiaoyuan Zhou
Phys. Rev. Applied 20, 014052 – Published 24 July 2023

Abstract

Thermoelectric (TE) coolers show considerable promise for replacing aging refrigeration devices, which suffer from the poor low-temperature performance of most TE materials due to the small entropy of carriers and weak lattice vibrational anharmonicity. Here we propose that two-dimensional (2D) semiconductors with multiple bonding layers can be potential TE cooling materials, and the 2D AMnX (A = Sr,Ba; X = Sn,Pb) family is identified as an example. Owing to the d-orbital inversion of the Mn element, both the valence and conduction bands possess continuously square-shaped band edges with slight energy divergence, which trigger high mobility and sharply enhanced density of states near the Fermi level, thereby producing large power factors for both p- and n- type materials. Moreover, the coexistence of soft covalent bonds and ionic layers lowers phonon group velocity and strengthens phonon scattering, resulting in extremely low lattice thermal conductivity. At optimal carrier concentrations, both p- and n-type SrMnPb quintuple layers can reach ultrahigh room-temperature ZT above 2.0, with excellent average ZT beyond 1.8 from 150 to 350 K. This work not only proposes a tellurium-free alternative for TE refrigeration, but also provides general indicators for guiding the search for high-performance TE cooling materials.

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  • Received 20 March 2023
  • Revised 8 June 2023
  • Accepted 30 June 2023

DOI:https://doi.org/10.1103/PhysRevApplied.20.014052

© 2023 American Physical Society

Physics Subject Headings (PhySH)

Energy Science & TechnologyCondensed Matter, Materials & Applied Physics

Authors & Affiliations

Xincan Wang1, De Zhang1, Xu Lu1, Guang Han2, Xiaolong Yang1, Guoyu Wang2, Zizhen Zhou1,*, Huixia Fu1,†, and Xiaoyuan Zhou1,‡

  • 1College of Physics and Center of Quantum Materials and Devices, Chongqing University, Chongqing 401331, China
  • 2College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China

  • *zzzhou@cqu.edu.cn
  • hxfu@cqu.edu.cn
  • xiaoyuan2013@cqu.edu.cn

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Vol. 20, Iss. 1 — July 2023

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