Waveguide Dispersion Tailoring by Using Embedded Impedance Surfaces

Yijing He, Yue Li, Liang Zhu, Hakan Bagci, Danilo Erricolo, and Pai-Yen Chen
Phys. Rev. Applied 10, 064024 – Published 11 December 2018
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Abstract

The capability to tailor the dispersion and the cut-off frequency of waveguides is of importance, as these essential parameters govern the operating frequency range and the waveguide dimension. Here, we propose the concept of substrate-integrated impedance surface (SIIS) that enables arbitrary control of propagation characteristics of closed-shape waveguides. Specifically, we develop a theoretical framework for the simplest form of SIIS constituted by a one-dimensional array of blind vias, which is equivalent to a homogenized surface capacitance embedded in the waveguide. We theoretically and experimentally demonstrate that loading a substrate-integrated waveguide (SIW) with a capacitive SIIS can effectively reduce its cut-off frequency, regardless of the transverse dimension of the SIW. In addition, a SIIS-loaded SIW exhibits several intriguing phenomena, such as the slow-wave guiding properties and the local field concentration. This SIIS-loading technique may open up new possibilities for miniaturization of various waveguide-based components and for enhancement of their uses in microwave sensing and nonlinear functions.

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  • Received 2 May 2018
  • Revised 4 October 2018

DOI:https://doi.org/10.1103/PhysRevApplied.10.064024

© 2018 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Yijing He1, Yue Li1,*, Liang Zhu2, Hakan Bagci3, Danilo Erricolo2, and Pai-Yen Chen2

  • 1Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
  • 2Department of Electrical and Computer Engineering, University of Illinois, Chicago, Illinois 60607, USA
  • 3Division of Computer, Electrical, and Mathematical Sciences and Engineering, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia

  • *lyee@tsinghua.edu.cn

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Issue

Vol. 10, Iss. 6 — December 2018

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