Picosecond ion-qubit manipulation and spin-phonon entanglement with resonant laser pulses

W.-X. Guo, Y.-K. Wu, Y.-Y. Huang, L. Feng, C.-X. Huang, H.-X. Yang, J.-Y. Ma, L. Yao, Z.-C. Zhou, and L.-M. Duan
Phys. Rev. A 106, 022608 – Published 11 August 2022

Abstract

Ultrafast spin-phonon entanglement based on spin-dependent momentum kicks (SDKs) provides an approach to realize fast entangling gates with intrinsic robustness and scalability for trapped ion quantum computing. Such SDKs so far have been implemented on a nanosecond timescale by off-resonant Raman transitions where each laser pulse is split into a sequence of perturbation pulses with carefully designed temporal patterns. Here we report an experimental realization of ultrafast qubit manipulation and spin-phonon entanglement in picoseconds using SDKs from single resonant laser pulses on the magnetic-field-insensitive hyperfine qubit states. This experiment demonstrates a convenient approach to ultrafast SDKs on noise-insensitive ion-spin qubits, with improvement in its speed by more than an order of magnitude. It removes the need to engineer the pattern of a sequence of perturbation pulses and is less vulnerable to noise, simplifying the approach to large-scale trapped-ion quantum computing based on fast quantum gates with SDKs.

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  • Received 23 May 2022
  • Accepted 3 August 2022

DOI:https://doi.org/10.1103/PhysRevA.106.022608

©2022 American Physical Society

Physics Subject Headings (PhySH)

Atomic, Molecular & OpticalQuantum Information, Science & Technology

Authors & Affiliations

W.-X. Guo1,2, Y.-K. Wu1,2, Y.-Y. Huang1,2, L. Feng1,2, C.-X. Huang1,2, H.-X. Yang1,3, J.-Y. Ma1,2, L. Yao3, Z.-C. Zhou1,2, and L.-M. Duan1,2,*

  • 1Center for Quantum Information, Institute for Interdisciplinary Information Sciences, Tsinghua University, Beijing 100084, People's Republic of China
  • 2Hefei National Laboratory, Hefei 230088, People's Republic of China
  • 3HYQ Co., Ltd., Beijing 100176, People's Republic of China

  • *Corresponding author: lmduan@tsinghua.edu.cn

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Issue

Vol. 106, Iss. 2 — August 2022

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