Temperature-dependent thermal and thermoelectric properties of n-type and p-type Sc1xMgxN

Bivas Saha, Jaime Andres Perez-Taborda, Je-Hyeong Bahk, Yee Rui Koh, Ali Shakouri, Marisol Martin-Gonzalez, and Timothy D. Sands
Phys. Rev. B 97, 085301 – Published 1 February 2018
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Abstract

Scandium Nitride (ScN) is an emerging rocksalt semiconductor with octahedral coordination and an indirect bandgap. ScN has attracted significant attention in recent years for its potential thermoelectric applications, as a component material in epitaxial metal/semiconductor superlattices, and as a substrate for defect-free GaN growth. Sputter-deposited ScN thin films are highly degenerate n-type semiconductors and exhibit a large thermoelectric power factor of 3.5×103W/mK2 at 600–800 K. Since practical thermoelectric devices require both n- and p-type materials with high thermoelectric figures-of-merit, development and demonstration of highly efficient p-type ScN is extremely important. Recently, the authors have demonstrated p-type Sc1xMgxN thin film alloys with low MgxNy mole-fractions within the ScN matrix. In this article, we demonstrate temperature dependent thermal and thermoelectric transport properties, including large thermoelectric power factors in both n- and p-type Sc1xMgxN thin film alloys at high temperatures (up to 850 K). Employing a combination of temperature-dependent Seebeck coefficient, electrical conductivity, and thermal conductivity measurements, as well as detailed Boltzmann transport-based modeling analyses of the transport properties, we demonstrate that p-type Sc1xMgxN thin film alloys exhibit a maximum thermoelectric power factor of 0.8×103W/mK2 at 850 K. The thermoelectric properties are tunable by adjusting the MgxNy mole-fraction inside the ScN matrix, thereby shifting the Fermi energy in the alloy films from inside the conduction band in case of undoped n-type ScN to inside the valence band in highly hole-doped p-type Sc1xMgxN thin film alloys. The thermal conductivities of both the n- and p-type films were found to be undesirably large for thermoelectric applications. Thus, future work should address strategies to reduce the thermal conductivity of Sc1xMgxN thin-film alloys, without affecting the power factor for improved thermoelectric performance.

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  • Received 12 June 2017
  • Revised 3 November 2017

DOI:https://doi.org/10.1103/PhysRevB.97.085301

©2018 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Bivas Saha1,*, Jaime Andres Perez-Taborda2, Je-Hyeong Bahk3, Yee Rui Koh4, Ali Shakouri4, Marisol Martin-Gonzalez2, and Timothy D. Sands5

  • 1Department of Materials Science and Engineering, University of California, Berkeley, California 94720, USA
  • 2Instituto de Microelectrónica de Madrid, CSIC, C/ Isaac Newton 8, Tres Cantos, 28760 Madrid, Spain
  • 3Department of Mechanical and Materials Engineering, University of Cincinnati, Cincinnati, Ohio 45221, USA
  • 4School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, USA
  • 5Bradley Department of Electrical and Computer Engineering and Department of Materials Science and Engineering, Virginia Tech, Blacksburg, Virginia 24061, USA

  • *bsaha@berkeley.edu

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Issue

Vol. 97, Iss. 8 — 15 February 2018

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