• Open Access

Long-range magnetic dipole-dipole interaction mediated by a superconductor

Yoav Romach, Tal Wasserman, Shai Tishby, and Nir Bar-Gill
Phys. Rev. Research 3, 033280 – Published 27 September 2021

Abstract

Quantum computations and simulations require strong coherent coupling between qubits, which may be spatially separated. Achieving this coupling for solid-state-based spin qubits is a long-standing challenge. Here we theoretically investigate a method for achieving such a coupling, based on superconducting nanostructures designed to channel the magnetic flux created by the qubits. We detail semiclassical analytical calculations and simulations of the magnetic field created by a magnetic dipole, depicting the spin qubit, positioned directly below nanofabricated apertures in a superconducting layer. We show that such structures could channel the magnetic flux, enhancing the dipole-dipole interaction between spin qubits and changing its scaling with distance, thus potentially paving the way for controllably engineering an interacting spin system.

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  • Received 1 March 2021
  • Accepted 14 July 2021

DOI:https://doi.org/10.1103/PhysRevResearch.3.033280

Published by the American Physical Society under the terms of the Creative Commons Attribution 4.0 International license. Further distribution of this work must maintain attribution to the author(s) and the published article's title, journal citation, and DOI.

Published by the American Physical Society

Physics Subject Headings (PhySH)

Quantum Information, Science & TechnologyCondensed Matter, Materials & Applied Physics

Authors & Affiliations

Yoav Romach1,*,†, Tal Wasserman1,*, Shai Tishby1,*, and Nir Bar-Gill1,2

  • 1The Racah Institute of Physics, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
  • 2Department of Applied Physics, Rachel and Selim School of Engineering, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel

  • *These authors contributed equally to this work.
  • Corresponding author: yoav.romach@mail.huji.ac.il

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Vol. 3, Iss. 3 — September - November 2021

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