Role of chemical disorder in slowing down diffusion in complex concentrated alloys

Shi-Cheng Dai, Yong Yang, and Yun-Jiang Wang
Phys. Rev. Materials 8, 033607 – Published 26 March 2024

Abstract

The advent of multiprincipal element alloys (MPEAs) has sparked significant interest in physical metallurgy. These alloys, distinguished by their high configurational entropy aimed at minimizing free energy, have raised intriguing questions regarding the interplay of chemical disorder and chemical short-range order (CSRO) in kinetics of MPEAs. Particularly, the widely assumed phenomenon of sluggish diffusion has come under scrutiny. Here we employ atomistic simulations to quantitatively evaluate the impact of CSRO on diffusion in a representative medium-entropy alloy. We introduce a physical order parameter to establish a quantitative correlation between CSRO and diffusivity. Surprisingly, our simulations suggest that CSRO, rather than chemical disorder, serves to suppress and localize defect diffusion. The observed link between diffusion activation energy and CSRO provides a rationale for the observed deceleration in diffusion due to chemical ordering. A linear relationship between diffusion activation energy and activation entropy is unveiled, aligning with the Meyer-Neldel rule, and replicating experimental results. These insights help clarify the intricate role of chemical disorder in plastic deformation of chemically disordered materials.

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  • Received 2 November 2023
  • Accepted 12 March 2024

DOI:https://doi.org/10.1103/PhysRevMaterials.8.033607

©2024 American Physical Society

Physics Subject Headings (PhySH)

  1. Research Areas
  1. Physical Systems
Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Shi-Cheng Dai1,2, Yong Yang3,*, and Yun-Jiang Wang1,2,†

  • 1State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
  • 2School of Engineering Science, University of Chinese Academy of Sciences, Beijing 101408, China
  • 3Department of Mechanical Engineering, College of Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Kowloon, Hong Kong SAR, China

  • *Corresponding author: yonyang@cityu.edu.hk
  • Corresponding author: yjwang@imech.ac.cn

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Issue

Vol. 8, Iss. 3 — March 2024

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