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Two-dimensional defect mapping of the SiO2/4HSiC interface

Judith Woerle, Brett C. Johnson, Corrado Bongiorno, Kohei Yamasue, Gabriel Ferro, Dipanwita Dutta, Thomas A. Jung, Hans Sigg, Yasuo Cho, Ulrike Grossner, and Massimo Camarda
Phys. Rev. Materials 3, 084602 – Published 15 August 2019
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Abstract

Current generations of 4H-SiC metal-oxide-semiconductor field-effect transistors are still challenged by the high number of defects at the SiO2/SiC interface that limit both the performance and gate reliability of these devices. One potential source of the high density of interface defect states (Dit) is the stepped morphology on commonly used off-axially grown epitaxial surfaces, favoring incomplete oxidation and the formation of defective transition layers. Here we report measurements on intentionally modified 4H-SiC surfaces exhibiting both atomically flat and stepped regions where the generation of interface defects can be directly linked to differences in surface roughness. By combining spatially resolving structural, chemical, optical, and electrical analysis techniques, a strong increase of Dit for stepped surfaces was revealed while regions with an atomically flat SiC surface exhibited close-to-ideal interface properties.

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  • Received 22 March 2019
  • Revised 14 June 2019

DOI:https://doi.org/10.1103/PhysRevMaterials.3.084602

©2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Judith Woerle1,2,*, Brett C. Johnson3, Corrado Bongiorno4, Kohei Yamasue5, Gabriel Ferro6, Dipanwita Dutta1, Thomas A. Jung1, Hans Sigg1, Yasuo Cho5, Ulrike Grossner2, and Massimo Camarda1,2

  • 1Paul Scherrer Institute, Forschungsstrasse 111, 5232 Villigen, Switzerland
  • 2Advanced Power Semiconductor Laboratory, ETH Zurich, Physikstrasse 3, 8092 Zurich, Switzerland
  • 3Centre for Quantum Computing and Communication Technology, School of Physics, University of Melbourne, Victoria 3010, Australia
  • 4Consiglio Nazionale delle Ricerche–Istituto per la Microelettronica e Microsistemi (CNR-IMM), Strada VIII 5, Zona Industriale, 95121 Catania, Italy
  • 5Research Institute of Electrical Communication, Tohoku University, 2-1-1 Katahira, Aoba, Sendai 980-8577, Japan
  • 6Laboratoire des Multimatériaux et Interfaces (UMR 5615), Université de Lyon, Université Claude Bernard Lyon 1, CNRS, 43 boulevard du 11 Novembre 1918, 69622 Villeurbanne, France

  • *woerle@aps.ee.ethz.ch

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Issue

Vol. 3, Iss. 8 — August 2019

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