Abstract
We report on the fabrication of conducting interfaces between and by off-axis sputtering in an Ar atmosphere. At a growth pressure of 0.04 mbar the interface is metallic, with a carrier density of the order of at 3 K. By increasing the growth pressure, we observe an increase of the out-of-plane lattice constants of the films while the in-plane lattice constants do not change. Also, the low-temperature sheet resistance increases with increasing growth pressure, leading to an insulating interface when the growth pressure reaches 0.10 mbar. We attribute the structural variations to an increase of the La/Al ratio, which also explains the transition from metallic behavior to insulating behavior of the interfaces. Our research shows that the control which is furnished by the Ar pressure makes sputtering as versatile a process as pulsed laser deposition, and emphasizes the key role of the cation stoichiometry of in the formation of the conducting interface.
- Received 29 October 2018
- Revised 26 January 2019
DOI:https://doi.org/10.1103/PhysRevMaterials.3.034002
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