Ablation of GaAs by Intense, Ultrafast Electronic Excitation from Highly Charged Ions

T. Schenkel, A. V. Hamza, A. V. Barnes, D. H. Schneider, J. C. Banks, and B. L. Doyle
Phys. Rev. Lett. 81, 2590 – Published 21 September 1998
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Abstract

We have measured total ablation rates and secondary ion yields from undoped GaAs(100) interacting with slow (v=6.6×105m/s), very highly charged ions. Ablation rates increase strongly as a function of projectile charge. Some 1400 target atoms are removed when a single Th70+ ion deposits a potential energy of 152.6 keV within a few femtoseconds into a nanometer-sized target volume. We discuss models for ablation of semiconductors by intense, ultrafast electronic excitation.

  • Received 16 March 1998

DOI:https://doi.org/10.1103/PhysRevLett.81.2590

©1998 American Physical Society

Authors & Affiliations

T. Schenkel, A. V. Hamza, A. V. Barnes, and D. H. Schneider

  • Lawrence Livermore National Laboratory, Livermore, California 94550

J. C. Banks and B. L. Doyle

  • Sandia National Laboratory, Albuquerque, New Mexico 87185-1056

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Vol. 81, Iss. 12 — 21 September 1998

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