Higher-Order Topological In-Bulk Corner State in Pure Diffusion Systems

Zhoufei Liu, Pei-Chao Cao, Liujun Xu, Guoqiang Xu, Ying Li, and Jiping Huang
Phys. Rev. Lett. 132, 176302 – Published 23 April 2024

Abstract

Compared with conventional topological insulator that carries topological state at its boundaries, the higher-order topological insulator exhibits lower-dimensional gapless boundary states at its corners and hinges. Leveraging the form similarity between Schrödinger equation and diffusion equation, research on higher-order topological insulators has been extended from condensed matter physics to thermal diffusion. Unfortunately, all the corner states of thermal higher-order topological insulator reside within the band gap. Another kind of corner state, which is embedded in the bulk states, has not been realized in pure diffusion systems so far. Here, we construct higher-dimensional Su-Schrieffer-Heeger models based on sphere-rod structure to elucidate these corner states, which we term “in-bulk corner states.” Because of the anti-Hermitian properties of diffusive Hamiltonian, we investigate the thermal behavior of these corner states through theoretical calculation, simulation, and experiment. Furthermore, we study the different thermal behaviors of in-bulk corner state and in-gap corner state. Our results would open a different gate for diffusive topological states and provide a distinct application for efficient heat dissipation.

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  • Received 20 June 2022
  • Accepted 26 March 2024

DOI:https://doi.org/10.1103/PhysRevLett.132.176302

© 2024 American Physical Society

Physics Subject Headings (PhySH)

  1. Physical Systems
Statistical Physics & Thermodynamics

Authors & Affiliations

Zhoufei Liu1, Pei-Chao Cao2,3,4, Liujun Xu5, Guoqiang Xu6, Ying Li2,3,4,*, and Jiping Huang1,†

  • 1Department of Physics, State Key Laboratory of Surface Physics, and Key Laboratory of Micro and Nano Photonic Structures (MOE), Fudan University, Shanghai 200438, China
  • 2State Key Laboratory of Extreme Photonics and Instrumentation, ZJU-Hangzhou Global Scientific and Technological Innovation Center, Zhejiang University, Hangzhou 310027, China
  • 3International Joint Innovation Center, Key Laboratory of Advanced Micro/Nano Electronic Devices & Smart Systems of Zhejiang, The Electromagnetics Academy of Zhejiang University, Zhejiang University, Haining 314400, China
  • 4Shaoxing Institute of Zhejiang University, Zhejiang University, Shaoxing 312000, China
  • 5Graduate School of China Academy of Engineering Physics, Beijing 100193, China
  • 6Department of Electrical and Computer Engineering, National University of Singapore, Kent Ridge 117583, Republic of Singapore

  • *eleying@zju.edu.cn
  • jphuang@fudan.edu.cn

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Issue

Vol. 132, Iss. 17 — 26 April 2024

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