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Record-High Tc and Dome-Shaped Superconductivity in a Medium-Entropy Alloy TaNbHfZr under Pressure up to 160 GPa

Liyunxiao Wu, Jianguo Si, Shixue Guan, He Zhang, Jie Dou, Jun Luo, Jie Yang, Hui Yu, Jiawei Zhang, Xiaoli Ma, Pengtao Yang, Rui Zhou, Miao Liu, Fang Hong, and Xiaohui Yu
Phys. Rev. Lett. 132, 166002 – Published 16 April 2024

Abstract

Superconductivity has been one of the focal points in medium and high-entropy alloys (MEAs-HEAs) since the discovery of the body-centered cubic (bcc) HEA superconductor in 2014. Until now, the superconducting transition temperature (Tc) of most MEA and HEA superconductors has not exceeded 10 K. Here, we report a TaNbHfZr bulk MEA superconductor crystallized in the BCC structure with a Tc of 15.3 K which set a new record. During compression, Tc follows a dome-shaped curve. It reaches a broad maximum of roughly 15 K at around 70 GPa before decreasing to 9.3 K at 157.2 GPa. First-principles calculations attribute the dome-shaped curve to two competing effects, that is, the enhancement of the logarithmically averaged characteristic phonon frequency ωlog and the simultaneous suppression of the electron-phonon coupling constant λ. Thus, TaNbHfZr MEA may have a promising future for studying the underlying quantum physics, as well as developing new applications under extreme conditions.

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  • Received 3 January 2024
  • Revised 6 March 2024
  • Accepted 25 March 2024

DOI:https://doi.org/10.1103/PhysRevLett.132.166002

© 2024 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Liyunxiao Wu1,2,*, Jianguo Si1,3,*, Shixue Guan4,*, He Zhang1,2, Jie Dou1,2, Jun Luo1, Jie Yang1, Hui Yu1,2, Jiawei Zhang1, Xiaoli Ma1, Pengtao Yang1,2, Rui Zhou1,3, Miao Liu1,3,5,†, Fang Hong1,2,3,‡, and Xiaohui Yu1,2,3,§

  • 1Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China
  • 2School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China
  • 3Songshan Lake Materials Laboratory, Dongguan, Guangdong 523808, China
  • 4School of Applied Science, Beijing Information Science and Technology University, Beijing 100192, China
  • 5Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

  • *These authors contributed equally to this letter.
  • Corresponding author: mliu@iphy.ac.cn
  • Corresponding author: hongfang@iphy.ac.cn
  • §Corresponding author: yuxh@iphy.ac.cn

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Issue

Vol. 132, Iss. 16 — 19 April 2024

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