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Magic Gap Ratio for Optimally Robust Fermionic Condensation and Its Implications for HighTc Superconductivity

N. Harrison and M. K. Chan
Phys. Rev. Lett. 129, 017001 – Published 29 June 2022
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Abstract

Bardeen-Schrieffer-Cooper (BCS) and Bose-Einstein condensation (BEC) occur at opposite limits of a continuum of pairing interaction strength between fermions. A crossover between these limits is readily observed in a cold atomic Fermi gas. Whether it occurs in other systems such as the high temperature superconducting cuprates has remained an open question. We uncover here unambiguous evidence for a BCS-BEC crossover in the cuprates by identifying a universal magic gap ratio 2Δ/kBTc6.5 (where Δ is the pairing gap and Tc is the transition temperature) at which paired fermion condensates become optimally robust. At this gap ratio, corresponding to the unitary point in a cold atomic Fermi gas, the measured condensate fraction N0 and the height of the jump δγ(Tc) in the coefficient γ of the fermionic specific heat at Tc are strongly peaked. In the cuprates, δγ(Tc) is peaked at this gap ratio when Δ corresponds to the antinodal spectroscopic gap, thus reinforcing its interpretation as the pairing gap. We find the peak in δγ(Tc) also to coincide with a normal state maximum in γ, which is indicative of a pairing fluctuation pseudogap above Tc.

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  • Received 26 October 2021
  • Revised 22 March 2022
  • Accepted 24 May 2022

DOI:https://doi.org/10.1103/PhysRevLett.129.017001

© 2022 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

N. Harrison and M. K. Chan

  • National High Magnetic Field Laboratory, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA

Comments & Replies

Comment on “Magic Gap Ratio for Optimally Robust Fermionic Condensation and Its Implications for High-Tc Superconductivity”

Jeffery L. Tallon
Phys. Rev. Lett. 130, 199701 (2023)

Harrison and Chan Reply:

N. Harrison and M. K. Chan
Phys. Rev. Lett. 130, 199702 (2023)

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Issue

Vol. 129, Iss. 1 — 1 July 2022

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