Hybrid Acoustic Topological Insulator in Three Dimensions

Cheng He, Si-Yuan Yu, Huaiqiang Wang, Hao Ge, Jiawei Ruan, Haijun Zhang, Ming-Hui Lu, and Yan-Feng Chen
Phys. Rev. Lett. 123, 195503 – Published 6 November 2019
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Abstract

Topological insulators (TIs), featured by a symmetry-protected gapless surface Dirac cone(s) in their complete energy band gaps, have been extended from condensed-matter physics to classical bosonic systems in the last decade. However, acoustic TIs in three dimensions remain elusive because of a lack of a spin or polarization degree of freedom for longitudinal airborne sound. Here, we experimentally demonstrate a feasible way to hybridize an acoustic TI in three dimensions based on band inversion through a three-dimensional (3D) hybrid Dirac point (HDP). Such a 3D HDP, with linear dispersion in the layer plane while quadratic out of the layer, is distinct from a general point with linear dispersion in all directions. Interestingly, a single nearly gapless conical-like dispersion for acoustic surface states can be achieved at both zigzag and armchair interfaces, supporting robust sound transport. Our findings can serve as a tabletop platform for exploring unique acoustic applications based on the two-dimensional topological interfaces.

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  • Received 23 April 2019

DOI:https://doi.org/10.1103/PhysRevLett.123.195503

© 2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Cheng He1,3,§, Si-Yuan Yu1,3,§, Huaiqiang Wang2,§, Hao Ge1, Jiawei Ruan2, Haijun Zhang2,3,*, Ming-Hui Lu1,3,4,†, and Yan-Feng Chen1,3,‡

  • 1National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China
  • 2National Laboratory of Solid State Microstructures & School of Physics, Nanjing University, Nanjing 210093, China
  • 3Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China
  • 4Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing University, Nanjing 210093, China

  • *Corresponding author. zhanghj@nju.edu.cn
  • Corresponding author. luminghui@nju.edu.cn
  • Corresponding author. yfchen@nju.edu.cn
  • §C. H., S.-Y. Y., H. W. contributed equally to this work.

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Issue

Vol. 123, Iss. 19 — 8 November 2019

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