Conductivity Induced by High-Field Terahertz Waves in Dielectric Material

B. D. O’Shea, G. Andonian, S. K. Barber, C. I. Clarke, P. D. Hoang, M. J. Hogan, B. Naranjo, O. B. Williams, V. Yakimenko, and J. B. Rosenzweig
Phys. Rev. Lett. 123, 134801 – Published 23 September 2019
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Abstract

An intense, subpicosecond, relativistic electron beam traversing a dielectric-lined waveguide generates very large amplitude electric fields at terahertz (THz) frequencies through the wakefield mechanism. In recent work employing this technique to accelerate charged particles, the generation of high-power, narrow-band THz radiation was demonstrated. The radiated waves contain fields with measured amplitude exceeding 2GV/m, orders of magnitude greater than those available by other THz generation techniques at a narrow bandwidth. For fields approaching the GV/m level, a strong damping has been observed in SiO2. This wave attenuation with an onset near 850MV/m is consistent with changes to the conductivity of the dielectric lining and is characterized by a distinctive latching mechanism that is reversible on longer timescales. We describe the detailed measurements that serve to clarify the underlying physical mechanisms leading to strong field-induced damping of THz radiation (hω=1.59meV, f=0.38THz) in SiO2, a bulk, wide band-gap (8.9 eV) dielectric.

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  • Received 10 June 2019

DOI:https://doi.org/10.1103/PhysRevLett.123.134801

© 2019 American Physical Society

Physics Subject Headings (PhySH)

Accelerators & BeamsCondensed Matter, Materials & Applied Physics

Authors & Affiliations

B. D. O’Shea1,2,*, G. Andonian1, S. K. Barber1,3, C. I. Clarke2, P. D. Hoang1, M. J. Hogan2, B. Naranjo1, O. B. Williams1, V. Yakimenko2, and J. B. Rosenzweig1

  • 1UCLA Department of Physics and Astronomy, 405 Hilgard Avenue, Los Angeles, California 90095, USA
  • 2SLAC National Accelerator Laboratory, Menlo Park, California 94025, USA
  • 3Lawrence Berkeley National Laboratory, University of California, Berkeley, California 94720, USA

  • *boshea@slac.stanford.edu

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Vol. 123, Iss. 13 — 27 September 2019

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