Enhanced Strength Through Nanotwinning in the Thermoelectric Semiconductor InSb

Guodong Li, Sergey I. Morozov, Qingjie Zhang, Qi An, Pengcheng Zhai, and G. Jeffrey Snyder
Phys. Rev. Lett. 119, 215503 – Published 21 November 2017
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Abstract

The conversion efficiency (zT) of thermoelectric (TE) materials has been enhanced over the last two decades, but their engineering applications are hindered by the poor mechanical properties, especially the low strength at working conditions. Here we used density functional theory (DFT) to show a strength enhancement in the TE semiconductor InSb arising from the twin boundaries (TBs). This strengthening effect leads to an 11% enhancement of the ideal shear strength in flawless crystalline InSb where this theoretical strength is considered as an upper bound on the attainable strength for a realistic material. DFT calculations reveal that the directional covalent bond rearrangements at the TB accommodating the structural mismatch lead to the anisotropic resistance against the deformation combined with the enhanced TB rigidity. This produces a strong stress response in the nanotwinned InSb. This work provides a fundamental insight for understanding the deformation mechanism of nanotwinned TE semiconductors, which is beneficial for developing reliable TE devices.

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  • Received 18 September 2017

DOI:https://doi.org/10.1103/PhysRevLett.119.215503

© 2017 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Guodong Li1,2,‡, Sergey I. Morozov3, Qingjie Zhang1,*, Qi An4,†, Pengcheng Zhai1, and G. Jeffrey Snyder2

  • 1State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China
  • 2Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
  • 3Department of Computer Simulation and Nanotechnology, South Ural State University, Chelyabinsk 454080, Russia
  • 4Department of Chemical and Materials Engineering, University of Nevada, Reno, Reno, Nevada 89557, USA

  • *Corresponding author. zhangqj@whut.edu.cn
  • Corresponding author. qia@unr.edu
  • Corresponding author. guodonglee@whut.edu.cn

Comments & Replies

Comment on “Enhanced Strength Through Nanotwinning in the Thermoelectric Semiconductor InSb”

Bo Yang, Xianghe Peng, Cheng Huang, Yinbo Zhao, and Tao Fu
Phys. Rev. Lett. 123, 119601 (2019)

Li, An, and Morozov Reply:

Guodong Li, Qi An, and Sergey I. Morozov
Phys. Rev. Lett. 123, 119602 (2019)

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Vol. 119, Iss. 21 — 24 November 2017

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