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Deconstructing Temperature Gradients across Fluid Interfaces: The Structural Origin of the Thermal Resistance of Liquid-Vapor Interfaces

Jordan Muscatello, Enrique Chacón, Pedro Tarazona, and Fernando Bresme
Phys. Rev. Lett. 119, 045901 – Published 25 July 2017
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Abstract

The interfacial thermal resistance determines condensation-evaporation processes and thermal transport across material-fluid interfaces. Despite its importance in transport processes, the interfacial structure responsible for the thermal resistance is still unknown. By combining nonequilibrium molecular dynamics simulations and interfacial analyses that remove the interfacial thermal fluctuations we show that the thermal resistance of liquid-vapor interfaces is connected to a low density fluid layer that is adsorbed at the liquid surface. This thermal resistance layer (TRL) defines the boundary where the thermal transport mechanism changes from that of gases (ballistic) to that characteristic of dense liquids, dominated by frequent particle collisions involving very short mean free paths. We show that the thermal conductance is proportional to the number of atoms adsorbed in the TRL, and hence we explain the structural origin of the thermal resistance in liquid-vapor interfaces.

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  • Received 12 April 2017

DOI:https://doi.org/10.1103/PhysRevLett.119.045901

© 2017 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Jordan Muscatello1, Enrique Chacón2, Pedro Tarazona3, and Fernando Bresme4,*

  • 1Department of Chemical Engineering, Imperial College London, SW7 2AZ London, United Kingdom
  • 2Instituto de Ciencia de Materiales de Madrid, CSIC, Sor Juana Inés de la Cruz 3, E-28049 Madrid, Spain
  • 3Departamento de Física Teórica de la Materia Condensada, IFIMAC Condensed Matter Physics Center, Universidad Autónoma de Madrid, Madrid 28049, Spain
  • 4Department of Chemistry, Imperial College London, SW7 2AZ London, United Kingdom

  • *f.bresme@imperial.ac.uk

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Issue

Vol. 119, Iss. 4 — 28 July 2017

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