Dimensional Crossover in a Charge Density Wave Material Probed by Angle-Resolved Photoemission Spectroscopy

C. W. Nicholson, C. Berthod, M. Puppin, H. Berger, M. Wolf, M. Hoesch, and C. Monney
Phys. Rev. Lett. 118, 206401 – Published 18 May 2017
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Abstract

High-resolution angle-resolved photoemission spectroscopy data reveal evidence of a crossover from one-dimensional (1D) to three-dimensional (3D) behavior in the prototypical charge density wave (CDW) material NbSe3. In the low-temperature 3D regime, gaps in the electronic structure are observed due to two incommensurate CDWs, in agreement with x-ray diffraction and electronic-structure calculations. At higher temperatures we observe a spectral weight depletion that approaches the power-law behavior expected in one dimension. From the warping of the quasi-1D Fermi surface at low temperatures, we extract the energy scale of the dimensional crossover. This is corroborated by a detailed analysis of the density of states, which reveals a change in dimensional behavior dependent on binding energy. Our results offer an important insight into the dimensionality of excitations in quasi-1D materials.

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  • Received 14 October 2016

DOI:https://doi.org/10.1103/PhysRevLett.118.206401

© 2017 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

C. W. Nicholson1,*, C. Berthod2, M. Puppin1, H. Berger3, M. Wolf1, M. Hoesch4, and C. Monney5

  • 1Department of Physical Chemistry, Fritz-Haber-Institut of the Max Planck Society, Faradayweg 4-6, Berlin 14915, Germany
  • 2Department of Quantum Matter Physics, University of Geneva, 24 quai Ernest-Ansermet, 1211 Geneva, Switzerland
  • 3Institut de la Matière Complexe, École Polytechnique Fédérale de Lausanne, 1015 Lausanne, Switzerland
  • 4Diamond Light Source, Harwell Campus, Didcot OX11 0DE Oxfordshire, United Kingdom
  • 5Institute of Physics, University of Zurich, Winterthurerstrasse 190, 8057 Zurich, Switzerland

  • *nicholson@fhi-berlin.mpg.de

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Issue

Vol. 118, Iss. 20 — 19 May 2017

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