How Wetting and Adhesion Affect Thermal Conductance of a Range of Hydrophobic to Hydrophilic Aqueous Interfaces

Natalia Shenogina, Rahul Godawat, Pawel Keblinski, and Shekhar Garde
Phys. Rev. Lett. 102, 156101 – Published 13 April 2009

Abstract

We quantify the strength of interfacial thermal coupling at water-solid interfaces over a broad range of surface chemistries from hydrophobic to hydrophilic using molecular simulations. We show that the Kapitza conductance is proportional to the work of adhesion—a wetting property of that interface—enabling the use of thermal transport measurements as probes of the molecular environment and bonding at an interface. Excellent agreement with experiments on similar systems [Z. B. Ge et al., Phys. Rev. Lett. 96, 186101 (2006)] highlights the convergence of simulation and experiments on these complex nanoscopic systems.

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  • Received 29 September 2008

DOI:https://doi.org/10.1103/PhysRevLett.102.156101

©2009 American Physical Society

Authors & Affiliations

Natalia Shenogina1, Rahul Godawat2, Pawel Keblinski1,†, and Shekhar Garde2,*

  • 1Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
  • 2Department of Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA

  • *gardes@rpi.edu
  • keblip@rpi.edu

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Issue

Vol. 102, Iss. 15 — 17 April 2009

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