Collective dielectric processes at the transition temperature of the SmC* and SmA* phase in a ferroelectric liquid crystal

Lokesh K. Gangwar, Ambika Bawa, Amit Choudhary, Surinder P. Singh, Rajesh, and Ashok M. Biradar
Phys. Rev. E 97, 062707 – Published 27 June 2018

Abstract

An anomalous dielectric relaxation process, called the partially unwound helical mode (p-UHM), is a collective dielectric process apart from the well known Goldstone and soft mode process; it is studied in the smectic C* (SmC*) phase and at the transition temperature of the SmC*SmA* phase in the ferroelectric liquid crystal (FLC) material. To avoid the surface effect, a thick cell of 40 μm thickness was prepared with highly rubbed surfaces of the ITO substrates. It has been observed that the dielectric properties in SmC* and at the Tc temperature are dominated by the p-UHM process which is dependent on an applied oscillating field in the SmC* phase. The probing ac and dc bias field dependences of all these collective dielectric processes have been reported in the SmC* and SmA* phases of FLC materials.

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  • Received 9 March 2018
  • Revised 1 June 2018
  • Corrected 25 April 2022

DOI:https://doi.org/10.1103/PhysRevE.97.062707

©2018 American Physical Society

Physics Subject Headings (PhySH)

  1. Physical Systems
Condensed Matter, Materials & Applied Physics

Corrections

25 April 2022

Correction: A second affiliation was added for the fourth and fifth authors. The order of the first and second affiliations and an invalid form of the second affiliation have now been set right.

Authors & Affiliations

Lokesh K. Gangwar1,2, Ambika Bawa1,2, Amit Choudhary3,*, Surinder P. Singh1,2, Rajesh1,2, and Ashok M. Biradar2,†

  • 1CSIR–National Physical Laboratory, Dr. K. S. Krishnan Marg, New Delhi-110012, India
  • 2Academy of Scientific and Innovative Research (AcSIR), Ghaziabad-201002, India
  • 3Physics Department, Deshbandhu College (University of Delhi), Kalkaji, New Delhi-110019, India

  • *amitnpl2005@gmail.com
  • abiradar.npl@gmail.com

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Issue

Vol. 97, Iss. 6 — June 2018

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