Stick-slip substructure in rapid tape peeling

S. T. Thoroddsen, H. D. Nguyen, K. Takehara, and T. G. Etoh
Phys. Rev. E 82, 046107 – Published 15 October 2010
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Abstract

The peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at 100m/s, which promotes the sound, so characteristic of this phenomenon.

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  • Received 9 April 2010

DOI:https://doi.org/10.1103/PhysRevE.82.046107

©2010 American Physical Society

Authors & Affiliations

S. T. Thoroddsen1, H. D. Nguyen2, K. Takehara2, and T. G. Etoh2

  • 1Division of Physical Sciences and Engineering, King Abdullah University of Science and Technology, Thuwal 23955-6900, Saudi Arabia
  • 2Civil and Environmental Engineering, Kinki University, Higashi-Osaka 577-8502, Japan

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Issue

Vol. 82, Iss. 4 — October 2010

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