Glassy relaxation in a de Vries smectic liquid crystal consisting of bent-core molecules

Vishnu Deo Mishra, G. Pratap, and Arun Roy
Phys. Rev. E 109, 024703 – Published 26 February 2024

Abstract

We report experimental investigations of a liquid crystal comprising thiophene-based achiral bent-core banana shaped molecules. The compound exhibits the following phase sequence on cooling: Isotropic (517.4 K), N (514.9 K), de Vries SmA (402 K), SmC. Practically no layer contraction was observed across the SmA to SmC transition, confirming the “de Vries” nature of the SmA phase. Interestingly, the crystallization does not occur on cooling the sample, unlike most other liquid crystals. Instead, the SmC phase undergoes a glass transition at 271 K even at a slow cooling rate. The dielectric spectroscopy studies carried out on the sample reveal the presence of a dielectric mode whose relaxation process is of the Cole-Cole type. The relaxation frequency of the mode was found to drop rapidly with decreasing temperature, confirming the glassy behavior. The variation of relaxation frequency with temperature follows the Vogel-Fulcher-Tammann equation, indicating the fragile glassy nature of the sample. This report identifies a bent-core liquid crystal exhibiting a “de Vries” SmA phase and glassy behavior at lower temperatures.

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  • Received 28 June 2023
  • Accepted 2 February 2024

DOI:https://doi.org/10.1103/PhysRevE.109.024703

©2024 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied PhysicsPolymers & Soft MatterStatistical Physics & Thermodynamics

Authors & Affiliations

Vishnu Deo Mishra1, G. Pratap2,*, and Arun Roy1,†

  • 1Soft Condensed Matter Group, Raman Research Institute, C. V. Raman Avenue, Sadashivanagar, Bangalore 560080, India
  • 2Polymer Science and Technology, CSIR-Central Leather Research Institute, Chennai 600020, India

  • *Present address: Academy of Scientific and Innovative Research (AcSIR), Ghaziabad 201002, India.
  • Corresponding author: aroy@rri.res.in

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Issue

Vol. 109, Iss. 2 — February 2024

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