Penetration of a supersonic particle at the interface in a binary complex plasma

He Huang, Mierk Schwabe, Hubertus M. Thomas, Andrey M. Lipaev, and Cheng-Ran Du
Phys. Rev. E 103, 013205 – Published 8 January 2021

Abstract

The penetration of a supersonic particle at the interface is studied in a binary complex plasma. Inspired by the experiments performed in the PK-3 Plus Laboratory on board the International Space Station, Langevin dynamics simulations were carried out. A Mach cone structure forms in the lateral wave behind the supersonic extra particle, where the kink of the cone flanks is observed at the interface. The propagation of the pulse-like perturbation along the interface is demonstrated by the evolution of the radial and axial velocity of the small particles in the vicinity of the interface. The decay of the pulse strength is determined by the friction, where the propagation distance can reach several interparticle distances for small damping rate. The dependence of the dynamics of the background particles in the vicinity of the interface on the penetration direction implies that the disparity of the mobility may be the cause of various interfacial effects.

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  • Received 15 March 2020
  • Revised 23 November 2020
  • Accepted 15 December 2020

DOI:https://doi.org/10.1103/PhysRevE.103.013205

©2021 American Physical Society

Physics Subject Headings (PhySH)

  1. Physical Systems
Plasma Physics

Authors & Affiliations

He Huang1, Mierk Schwabe2, Hubertus M. Thomas2, Andrey M. Lipaev3,4, and Cheng-Ran Du1,5,*

  • 1College of Science, Donghua University, Shanghai 201620, People's Republic of China
  • 2Institut für Materialphysik im Weltraum, Deutsches Zentrum für Luft- und Raumfahrt (DLR), Weßling 82234, Germany
  • 3Joint Institute for High Temperature, Moscow 125412, Russia
  • 4Moscow Institute of Physics and Technology (MIPT), Dolgoprudny 141701, Russia
  • 5Member of Magnetic Confinement Fusion Research Centre, Ministry of Education, Shanghai 201620, People's Republic of China

  • *chengran.du@dhu.edu.cn

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Vol. 103, Iss. 1 — January 2021

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