Impact of thermal fluctuations on transport in antiferromagnetic semimetals

Youngseok Kim, Moon Jip Park, David G. Cahill, and Matthew J. Gilbert
Phys. Rev. B 98, 024409 – Published 10 July 2018

Abstract

Recent demonstrations on manipulating antiferromagnetic (AF) order have triggered a growing interest in antiferromagnetic metal, and potential high-density spintronic applications demand further improvements in the anisotropic magnetoresistance (AMR). The antiferromagnetic semimetals (AFS) are newly discovered materials that possess massless Dirac fermions that are protected by the crystalline symmetries. In this material, a reorientation of the AF order may break the underlying symmetries and induce a finite energy gap. As such, the possible phase transition from the semimetallic to insulating phase gives us a choice for a wide range of resistance, ensuring a large AMR. To further understand the robustness of the phase transition, we study thermal fluctuations of the AF order in AFS at a finite temperature. For macroscopic samples, we find that the thermal fluctuations effectively decrease the magnitude of the AF order by renormalizing the effective Hamiltonian. Our finding suggests that the insulating phase exhibits a gap narrowing at elevated temperatures, which leads to a substantial decrease in AMR. We also examine spatially correlated thermal fluctuations for microscopic samples by solving the microscopic Landau-Lifshitz-Gilbert equation, finding a quantitative difference in the gap narrowing effect from that of the macroscopic sample. For both cases, the semimetallic phase shows a minimal change in its transmission spectrum, illustrating the robustness of the symmetry-protected states in AFS. Our finding may serve as a guideline for estimating and maximizing AMR of the AFS samples at elevated temperatures.

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  • Received 28 May 2018

DOI:https://doi.org/10.1103/PhysRevB.98.024409

©2018 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Youngseok Kim1,2, Moon Jip Park3, David G. Cahill4, and Matthew J. Gilbert1,2,5

  • 1Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
  • 2Micro and Nanotechnology Laboratory, University of Illinois, 208 N. Wright Street, Urbana, Illinois 61801, USA
  • 3Department of Physics, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
  • 4Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA
  • 5Department of Electrical Engineering, Stanford University, Stanford, California 94305, USA

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Issue

Vol. 98, Iss. 2 — 1 July 2018

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