Thermal transport across metal silicide-silicon interfaces: First-principles calculations and Green's function transport simulations

Sridhar Sadasivam, Ning Ye, Joseph P. Feser, James Charles, Kai Miao, Tillmann Kubis, and Timothy S. Fisher
Phys. Rev. B 95, 085310 – Published 22 February 2017
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Abstract

Heat transfer across metal-semiconductor interfaces involves multiple fundamental transport mechanisms such as elastic and inelastic phonon scattering, and electron-phonon coupling within the metal and across the interface. The relative contributions of these different transport mechanisms to the interface conductance remains unclear in the current literature. In this work, we use a combination of first-principles calculations under the density functional theory framework and heat transport simulations using the atomistic Green's function (AGF) method to quantitatively predict the contribution of the different scattering mechanisms to the thermal interface conductance of epitaxial CoSi2-Si interfaces. An important development in the present work is the direct computation of interfacial bonding from density functional perturbation theory (DFPT) and hence the avoidance of commonly used “mixing rules” to obtain the cross-interface force constants from bulk material force constants. Another important algorithmic development is the integration of the recursive Green's function (RGF) method with Büttiker probe scattering that enables computationally efficient simulations of inelastic phonon scattering and its contribution to the thermal interface conductance. First-principles calculations of electron-phonon coupling reveal that cross-interface energy transfer between metal electrons and atomic vibrations in the semiconductor is mediated by delocalized acoustic phonon modes that extend on both sides of the interface, and phonon modes that are localized inside the semiconductor region of the interface exhibit negligible coupling with electrons in the metal. We also provide a direct comparison between simulation predictions and experimental measurements of thermal interface conductance of epitaxial CoSi2-Si interfaces using the time-domain thermoreflectance technique. Importantly, the experimental results, performed across a wide temperature range, only agree well with predictions that include all transport processes: elastic and inelastic phonon scattering, electron-phonon coupling in the metal, and electron-phonon coupling across the interface.

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  • Received 12 September 2016
  • Revised 12 November 2016

DOI:https://doi.org/10.1103/PhysRevB.95.085310

©2017 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Sridhar Sadasivam1, Ning Ye2, Joseph P. Feser2, James Charles3,4, Kai Miao3,4, Tillmann Kubis3, and Timothy S. Fisher1,*

  • 1School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, USA
  • 2Department of Mechanical Engineering, University of Delaware, Newark, Delaware, 19716, USA
  • 3Network for Computational Nanotechnology (NCN), Purdue University, West Lafayette, Indiana 47907, USA
  • 4School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, USA

  • *tsfisher@purdue.edu

See Also

Thermal transport across metal silicide-silicon interfaces: An experimental comparison between epitaxial and nonepitaxial interfaces

Ning Ye, Joseph P. Feser, Sridhar Sadasivam, Timothy S. Fisher, Tianshi Wang, Chaoying Ni, and Anderson Janotti
Phys. Rev. B 95, 085430 (2017)

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Vol. 95, Iss. 8 — 15 February 2017

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