Full counting statistics of phonon-assisted Andreev tunneling through a quantum dot coupled to normal and superconducting leads

Bing Dong, G. H. Ding, and X. L. Lei
Phys. Rev. B 95, 035409 – Published 10 January 2017

Abstract

We present a theoretical investigation for the full counting statistics of the Andreev tunneling through a quantum dot (QD) embedded between superconducting (SC) and normal leads in the presence of a strong on-site electron-phonon interaction using nonequilibrium Green function method. For this purpose, we generalize the dressed tunneling approximation (DTA) recently developed in dealing with inelastic tunneling in a normal QD system to the Andreev transport issue. This method takes account of vibrational effect in evaluation of electronic tunneling self energy in comparison with other simple approaches and meanwhile allows us to derive an explicit analytical formula for the cumulant generating function at the subgap region. We then analyze the interplay of polaronic and SC proximity effects on the Andreev reflection spectrum, current-voltage characteristics, and current fluctuations of the hybrid system. Our main findings include: (1) no phonon side peaks in the linear Andreev conductance; (2) a negative differential conductance stemming from the suppressed Andreev reflection spectrum; (3) a novel inelastic resonant peak in the differential conductance due to phonon assisted Andreev reflection; (4) enhancement or suppression of shot noise for the symmetric or asymmetric tunnel-coupling system, respectively.

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  • Received 10 November 2016

DOI:https://doi.org/10.1103/PhysRevB.95.035409

©2017 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Bing Dong, G. H. Ding, and X. L. Lei

  • Key Laboratory of Artificial Structures and Quantum Control (Ministry of Education), Department of Physics and Astronomy, Shanghai Jiaotong University, 800 Dongchuan Road, Shanghai 200240, China and Collaborative Innovation Center of Advanced Microstructures, Nanjing, China

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Issue

Vol. 95, Iss. 3 — 15 January 2017

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