Pressure-induced reemergence of superconductivity in topological insulator Sr0.065Bi2Se3

Yonghui Zhou, Xuliang Chen, Ranran Zhang, Jifeng Shao, Xuefei Wang, Chao An, Ying Zhou, Changyong Park, Wei Tong, Li Pi, Zhaorong Yang, Changjin Zhang, and Yuheng Zhang
Phys. Rev. B 93, 144514 – Published 26 April 2016

Abstract

The recently discovered SrxBi2Se3 superconductor provides an alternative and ideal material base for investigating possible topological superconductivity. Here, we report that in Sr0.065Bi2Se3, the ambient superconducting phase is gradually depressed upon the application of external pressure. At high pressure, a second superconducting phase emerges at above 6 GPa, with a maximum Tc value of 8.3 K. The joint investigations of the high-pressure synchrotron x-ray diffraction and electrical transport properties reveal that the reemergence of superconductivity in Sr0.065Bi2Se3 is closely related to the structural phase transition from an ambient rhombohedral phase to a high-pressure monoclinic phase around 6 GPa, and further to another high-pressure tetragonal phase above 25 GPa.

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  • Received 9 March 2016

DOI:https://doi.org/10.1103/PhysRevB.93.144514

©2016 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Yonghui Zhou1,2, Xuliang Chen1,2, Ranran Zhang1, Jifeng Shao1, Xuefei Wang1,2, Chao An1,2, Ying Zhou1,2, Changyong Park3, Wei Tong1, Li Pi1,4, Zhaorong Yang1,2,4,*, Changjin Zhang1,4,†, and Yuheng Zhang1,4

  • 1High Magnetic Field Laboratory, Chinese Academy of Sciences and University of Science and Technology of China, Hefei 230026, China
  • 2Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, Hefei 230031, China
  • 3High Pressure Collaborative Access Team, Geophysical Laboratory, Carnegie Institution of Washington, Argonne, Illinois 60439, USA
  • 4Collaborative Innovation Center of Advanced Microstructures, Nanjing 210093, China

  • *zryang@issp.ac.cn
  • zcjin@ustc.edu.cn

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Issue

Vol. 93, Iss. 14 — 1 April 2016

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